NEN EN IEC 60191-6-21 : 2010
Current
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The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
Published date
12-01-2013
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Defines methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-21 : 2010 | Identical |
| IEC 60191-6-21:2010 | Identical |
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