NEN NPR IEC/PAS 60191-6-18 : 2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
24-03-2010
12-01-2013
Defines common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
DocumentType |
Standard
|
PublisherName |
Netherlands Standards
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
IEC PAS 60191-6-18:2008 | Identical |
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