NF EN 60603-12 : 1998
Current
The latest, up-to-date edition.
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 12: DETAIL SPECIFICATION FOR DIMENSIONS, GENERAL REQUIREMENTS AND TESTS FOR A RANGE OF SOCKET DESIGNED FOR USE WITH INTEGRATED CIRCUITS
12-01-2013
1 Scope
2 Normative references
3 IEC type designation
4 Common features
5 Dimensions
6 Characteristics
7 Test schedule
8 Dual-in-line sockets with solder termination for
through-board insertion (standard type)
9 Dual-in-line sockets with solderless wire wrapping
terminations for through-board insertion (standard type)
10 Dual-in-line sockets with solder terminations for
through-board insertion (low-profile type)
11 Dual-in-line sockets with solderless wire wrapping
terminations for through-board insertion (low-profile type)
12 Individual contact retention force gauge
13 Socket gauges
Annex ZA (normative) Normative references to international
publications with their corresponding European publications
Describes dimensions, general requirements and tests for a range of sockets designed to be used with integrated circuits in dual-in-line format. Covers standard and low-profile types. Does not apply to test/burn-in sockets.
| DevelopmentNote |
Indice de classement: C93-430-12. (07/2014)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60603-12:1998-07 | Identical |
| IEC 60603-12:1992 | Identical |
| BS EN 60603-12:1998 | Identical |
| EN 60603-12:1998 | Identical |
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