NF EN 60749-3 : 2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
05-10-2021
12-01-2013
Foreword
1 Scope
2 Test apparatus
3 Procedure
4 Failure criteria
5 Summary
Verifies that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| DevelopmentNote |
Indice de classement: C96-022-3. (03/2003) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 60749-3:2003-04 | Identical |
| EN 60749-3:2017 | Identical |
| I.S. EN 60749-3:2017 | Identical |
| UNE-EN 60749-3:2003 | Identical |
| IEC 60749-3:2017 | Identical |
| NBN EN 60749-3 : 2003 | Identical |
| BS EN 60749-3:2002 | Identical |
| BS EN 60749-3:2017 | Identical |
| NF EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.