NF EN 60749-3 : 2002
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
Published date
12-01-2013
Publisher
Withdrawn date
05-10-2021
Superseded by
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Foreword
1 Scope
2 Test apparatus
3 Procedure
4 Failure criteria
5 Summary
Verifies that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| DevelopmentNote |
Indice de classement: C96-022-3. (03/2003) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 60749-3:2003-04 | Identical |
| EN 60749-3:2017 | Identical |
| I.S. EN 60749-3:2017 | Identical |
| IEC 60749-3:2017 | Identical |
| NBN EN 60749-3 : 2003 | Identical |
| BS EN 60749-3:2002 | Identical |
| BS EN 60749-3:2017 | Identical |
| UNE-EN 60749-3:2003 | Identical |
| NF EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
Summarise
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