• I.S. EN 60749-3:2017

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2017

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    National Foreword
    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test apparatus
    5 Procedure
    6 Failure criteria
    7 Summary
    Annex A (informative) - External visual report form/checklist
            (example only not a mandatory template)
    Bibliography
    Annex ZA (normative) - Normative references to international
             Publications with their corresponding
             European publications

    Abstract - (Show below) - (Hide below)

    Defines the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
    IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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