NF EN 60749-37 : 2008

Current

Current The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER

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Published date: 12-01-2013

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Development Note	Indice de classement: C96-022-37. PR NF EN 60749-37 March 2006. (03/2006)
Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Current

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
NF EN 60749-20-1 : 2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
NF EN 60749-10 : 2002	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 10: MECHANICAL SHOCK
IEC 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
NF EN 60749-20 : 2010	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60749-20-1:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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Development Note	Indice de classement: C96-022-37. PR NF EN 60749-37 March 2006. (03/2006)
Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Current

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
NF EN 60749-20-1 : 2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
NF EN 60749-10 : 2002	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 10: MECHANICAL SHOCK
IEC 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
NF EN 60749-20 : 2010	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60749-20-1:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat