NF EN 60749-4 : 2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
29-09-2021
12-01-2013
Foreword
1 Scope
2 HAST test - General remarks
3 Test apparatus
4 Test conditions
5 Procedure
6 Failure criteria
7 Safety
8 Summary
Bibliography
Gives a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
| DevelopmentNote |
Indice de classement: C96-022-4. (03/2003) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
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| SupersededBy |
| Standards | Relationship |
| UNE-EN 60749-4:2003 | Identical |
| NBN EN 60749-4 : 2003 | Identical |
| I.S. EN 60749-4:2017 | Identical |
| BS EN 60749-4:2002 | Identical |
| IEC 60749-4:2017 | Identical |
| EN 60749-4:2017 | Identical |
| DIN EN 60749-4:2016-06 (Draft) | Identical |
| BS EN 60749-4:2017 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| NF EN 60749-5 : 2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
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