NF EN 60749-5 : 2003

Withdrawn

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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST

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Withdrawn date: 04-10-2021

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Published date: 12-01-2013

Publisher: Association Francaise de Normalisation

Table of Contents - (Show below) - (Hide below)

Foreword
1 Scope
2 Normative references
3 General
4 Equipment
5 Test conditions
6 Procedures
7 Failure criteria
8 Safety
9 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding European
Publications

Abstract - (Show below) - (Hide below)

Covers a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.

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Development Note	Indice de Classement: C96-022-5 PR NF EN 60749-5 April 2002. (03/2002) Supersedes NF EN 60749. (06/2007)
Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Withdrawn
Superseded By	NF EN 60749-5:2017

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 60749-5:2017	Identical
UNE-EN 60749-5:2003	Identical
NBN EN 60749-5 : 2004	Identical
SN EN 60749-5 : 2003	Identical
BS EN 60749-5:2017	Identical
EN 60749-5:2017	Identical
I.S. EN 60749-5:2017	Identical
DIN EN 60749-5:2003-09	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

NF EN 60749-30 : 2005 AMD 1 2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60749-4:2017	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
NF EN 60749-4 : 2002	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)

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