Skip to content
Please enter a keyword to search

  • NF EN 61190-1-2 : 2014

    Current The latest, up-to-date edition.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

    Available format(s): 

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

    Sorry this product is not available in your region.

    Add To Cart

    Abstract - (Show below) - (Hide below)

    La présente partie de la CEI 61190 spécifie les exigences d'ordre général relatives à la caractérisation et au controle des crèmes à braser utilisées pour obtenir des interconnexions de haute qualité dans l'assemblage de composants électroniques. La présente norme prescrit un document de controle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Des informations relatives à la caractérisation, au controle de la qualité et aux documents de commande du flux à braser et du flux composé de matériaux sont disponibles dans la CEI 61190-1-1.

    General Product Information - (Show below) - (Hide below)

    Development Note Indice de classement: C90-700-1-2. (10/2003) PR NF EN 61190-1-2 February 2006. (02/2006) 2008 version is still active. (10/2014)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    NF EN 62137-1-5 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
    NF EN 62137-1-4 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
    NF EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective