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  • NF EN 61189-5 : 2008

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES

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    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    AVANT-PROPOS
    INTRODUCTION
    1 Domaine d'application
    2 Références normatives
    3 Exactitude, fidélité et résolution
    4 Catalogue des méthodes d'essai approuvées
    5 P: Méthodes d'essai de préparation/conditionnement
    6 V: Méthodes d'essai visuel
    7 D: Méthodes d'essai dimensionnel
    8 C: Méthodes d'essai chimique
    9 M: Méthodes d'essai mécanique
    10 E: Méthodes d'essai électrique
    11 N: Méthodes d'essai environnemental
    12 Méthodes d'essai diverses X
    Bibliographie
    Annexe ZA (normative) Références normatives à d'autres
              publications internationales avec les publications
              européennes correspondantes

    Abstract - (Show below) - (Hide below)

    La présente partie de la CEI 61189 est un catalogue de méthodes d'essai représentant les méthodologies et modes opératoires applicables aux assemblages de carte à circuit imprimé soumis à essai.

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    Development Note Indice de classement: C93-735. PR NF EN 61189-5 April 2004. (04/2004)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications

    Standards Referencing This Book - (Show below) - (Hide below)

    NF ISO 5725-2 : 1994 APPLICATION OF STATISTICS - ACCURACY (TRUENESS AND PRECISION) OF MEASUREMENT METHODS AND RESULTS - PART 2: BASIC METHOD FOR THE DETERMINATION OF REPEATABILITY AND REPRODUCIBILITY OF A STANDARD MEASUREMENT METHOD
    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    NF EN 61189-6 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES
    NF EN 61190-1-2 : 2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    NF EN 61249-2-7 : 2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    NF EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    NF EN 61189-3 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    NF EN ISO 9455-2 : 1995 SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD
    ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    NF EN 60068-1 : 2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
    NFC 20 720 : 87 AMD 1 1988 BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
    ISO 5725-2:1994 Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
    ISO 9001:2015 Quality management systems — Requirements
    NF EN 2199455-1 : 1994 SOFT SOLDERING FLUXES - TEST METHODS - PART 1: DETERMINATION OF NON-VOLATILE MATTER, GRAVIMETRIC METHOD
    NF EN 62137 : 2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    NF EN ISO 9001 : 2015 QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    NF EN 61189-1 : 98 AMD 1 2002 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
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