• NF EN 62025-2 : 2005

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS

    Available format(s): 

    Superseded date:  11-11-2021

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    AVANT-PROPOS
    1 Domaine d'application
    2 Références normatives
    3 Termes et définitions
    4 Conditions d'essai
      4.1 Conditions atmosphériques normales pour les essais
      4.2 Conditions d'arbitrage
    5 Essais des caractéristiques mécaniques
      5.1 Essai de résistance du corps
      5.2 Robustesse des sorties (électrodes)
      5.3 Soudabilité
      5.4 Résistance à la chaleur de soudage
      5.5 Résistance à la dissolution de la métallisation
      5.6 Vibrations
      5.7 Résistance aux chocs
    Annexe A (normative) Montage de l'inductance à montage
                         en surface sur la carte de circuit
                         imprimé d'essai
    Annexe ZA (normative) Références normatives à d'autres
                          publications internationales avec
                          les publications européennes
                          correspondantes
    Figure 1 - Méthode pour exercer la pression sur le corps
    Figure 2 - Gabarit de mise en pression (gabarit presseur)
    Figure 3 - Exemple de carte de circuit imprimé
    Figure 4 - Disposition
    Figure 5 - Gabarit de mise en pression (gabarit presseur)
    Figure 6 - Mise en pression
    Figure 7 - Mise en pression et forme de gabarit
    Figure 8 - Profil de température de refusion
    Tableau 1 - Taille des pastilles de soudure par le code des
                inductances miniatures multicouches
    Tableau 2 - Epaisseur de la pâte à souder par le code de
                taille des inductances
    Tableau 3 - Conditions d'immersion dans la soudure
    Tableau 4 - Température de refusion
    Tableau 5 - Sévérité
    Tableau 6 - Température de refusion
    Tableau 7 - Conditions de vibrations

    Abstract - (Show below) - (Hide below)

    Describes the test method for the non-electrical characteristics of the Surface Mounted Device (SMD) inductors to be used for electronic and telecommunication equipment.

    General Product Information - (Show below) - (Hide below)

    Development Note Indice de classement: C93-371-2 PR NF EN 62025-2 February 2004 (02/2004)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 62211:2017 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    NF EN 60068 2-69 : 2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    NF EN 61190-1-2 : 2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    NF EN 62211 : 2004 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    NF EN 60068 2-45 : 1993 AMD 1 1994 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST XA AND GUIDANCE: IMMERSION IN CLEANING SOLVENTS
    IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    NF EN 60068-1 : 2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
    NFC 20 720 : 87 AMD 1 1988 BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
    NF EN 60068 2-6 : 2008 ENVIRONMENTAL TESTING - PART 2-6: TESTS - TEST FC: VIBRATION (SINUSOIDAL)
    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
    NF EN 60068 2-27 : 2009 ENVIRONMENTAL TESTING - PART 2-27: TESTS - TEST EA AND GUIDANCE: SHOCK
    NF EN 61188-5-2 : 2004 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    NF EN 60068 2-77 : 2001 ENVIRONMENTAL TESTING - PAT 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK
    NF EN 60068-2-21 : 2013 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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