IEC 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
HD 323.2.20 : 200S3
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
IEC 62211:2017
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Inductive components - Reliability management |
IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-27:2008
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Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
NF EN 60068 2-69 : 2017
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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
NF EN 61190-1-2 : 2014
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
NF EN 62211 : 2004
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INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
NF EN 60068 2-45 : 1993 AMD 1 1994
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ENVIRONMENTAL TESTING - PART 2: TESTS - TEST XA AND GUIDANCE: IMMERSION IN CLEANING SOLVENTS |
IEC 60068-2-77:1999
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Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
NF EN 60068-1 : 2014
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
NFC 20 720 : 87 AMD 1 1988
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING |
NF EN 60068 2-6 : 2008
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ENVIRONMENTAL TESTING - PART 2-6: TESTS - TEST FC: VIBRATION (SINUSOIDAL) |
NF EN 61190-1-3 : 2008 AMD 1 2010
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Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
NF EN 60068 2-27 : 2009
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ENVIRONMENTAL TESTING - PART 2-27: TESTS - TEST EA AND GUIDANCE: SHOCK |
NF EN 61188-5-2 : 2004
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
NF EN 60068 2-77 : 2001
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ENVIRONMENTAL TESTING - PAT 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK |
NF EN 60068-2-21 : 2013
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ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
IEC 60068-2-69:2017
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Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
IEC 61190-1-3:2007+AMD1:2010 CSV
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |