NF EN IEC 61760-3:2021
Current
Current
The latest, up-to-date edition.
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published date
01-03-2021
Publisher
Sorry this product is not available in your region.
This part ofIEC 61760gives a reference set of requirements, process conditions and related test conditions to be used when compilingspecificationsof electronic components that are intended for usage in through-hole reflowsolderingtechnology.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61760-3:2021 | Identical |
| EN IEC 61760-3:2021 | Identical |
Summarise
Sorry this product is not available in your region.