Development Note
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Indice de classement: C90-710-3. PR NF EN 61760-3 July 2009. (07/2009) |
Document Type
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Standard |
ISBN
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|
Pages
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Published
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|
Publisher
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Association Francaise de Normalisation
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Status
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Withdrawn |
Superseded By
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IEC 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
IEC 60749-20:2008
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 62090:2017
|
Product package labels for electronic components using bar code and two-dimensional symbologies |
IEC 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60286-5:2003+AMD1:2009 CSV
|
Packaging of components for automatic handling - Part 5: Matrixtrays |
IEC 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
ISO 8601:2004
|
Data elements and interchange formats Information interchange Representation of dates and times |
IEC 60068-2-77:1999
|
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
IEC 60062:2016
|
Marking codes for resistors and capacitors |
IEC 60286-3:2013
|
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
IEC 60286-4:2013
|
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
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