NF EN ISO 9455-17 : 2006
Current
The latest, up-to-date edition.
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
12-01-2013
Avant-propos
1 Domaine d'application
2 Références normatives
3 Principe
4 Réactifs
5 Appareillage
6 Controle des coupons d'essai
7 Préparation des échantillons
8 Mode opératoire
9 Évaluation
10 Précision
11 Rapport d'essai
Annexe A (informative) Lignes directrices sur l'essai
de RIS
Annexe B (informative) Essai au peigne et essai de
migration électrochimique de résistance
d'isolement de surface des résidus de
flux - Rapport d'essai de qualification
Bibliographie
Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.
| DevelopmentNote |
Indice de classement: A81-365-17 PR NF EN ISO 9455-17 March 2006 (03/2006)
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
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| Standards | Relationship |
| I.S. EN ISO 9455-17:2006 | Identical |
| EN ISO 9455-17:2006 | Identical |
| NS EN ISO 9455-17 : 1ED 2006 | Identical |
| UNE-EN ISO 9455-17:2007 | Identical |
| UNI EN ISO 9455-17 : 2007 | Identical |
| ISO 9455-17:2002 | Identical |
| DIN EN ISO 9455-17:2006-09 | Identical |
| BS EN ISO 9455-17:2006 | Identical |
| ONORM EN ISO 9455-17 : 2006 | Identical |
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