PD IEC/TR 62258-7:2007
Current
The latest, up-to-date edition.
Semiconductor die products XML schema for data exchange
Hardcopy , PDF
English
30-11-2007
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INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General
5 Data exchange
Annex A (normative) - XML schema
Annex B (informative) - XML example
Bibliography
Assists the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 06/30146849 DC. (12/2007)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.
| Standards | Relationship |
| IEC TR 62258-7:2007 | Identical |
| CLC/TR 62258-7:2007 | Identical |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
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