PD IEC/TS 62647-23:2013
Current
The latest, up-to-date edition.
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Hardcopy , PDF
English
31-10-2013
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
GEL/107
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| DevelopmentNote |
Supersedes DD IEC PAS 62647-23. (10/2013)
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| DocumentType |
Standard
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| Pages |
49
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| PublisherName |
British Standards Institution
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| Status |
Current
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| Supersedes |
This part of IEC 62647 provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow therepair technician to execute the task.
This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “rework/repair” is used as defined in 3.1.29 and 3.1.30.
The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
NOTE 1 For the purposes of this document, if the element “lead” is implied, it will be stated either as Pb, as lead (Pb), or as tin-lead. If a piece part terminal or termination “lead” is referred to, such as in a flat pack or a dualinline package, the nomenclature lead/terminal or lead-terminal will be used.
NOTE 2 Processes identified in the document apply to either rework or repair. This document may be used by other high-performance and high-reliability industries, at their discretion.
| Standards | Relationship |
| IEC TS 62647-23:2013 | Identical |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IEC TS 62647-21:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IPC 1752 : A-2 | MATERIALS DECLARATION MANAGEMENT |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
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