PD IEC/TS 62878-2-1:2015
Current
The latest, up-to-date edition.
Device embedded substrate Guidelines. General description of technology
Hardcopy , PDF
English
30-04-2015
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technology of device embedded substrate
5 Jisso mounting and interconnection
6 Naming of each section
Bibliography
Defines the basics of device embedding substrate.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This part of IEC 62878 describes the basics of device embedding substrate.
This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
| Standards | Relationship |
| IEC TS 62878-2-1:2015 | Identical |
| IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
| IEC 62421:2007 | Electronics assembly technology - Electronic modules |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
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