PD IEC/TS 62878-2-3:2015
Current
The latest, up-to-date edition.
Device embedded substrate Guidelines. Design guide
Hardcopy , PDF
English
30-04-2015
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definition and abbreviations
4 Structure of device embedded substrates
5 Conditions to prepare base and embedding devices
6 Recommendation for embedding devices
7 Design specification of device embedded substrate
Bibliography
Defines the design guide of device embedded substrates.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This part of IEC 62878 describes the design guide of device embedded substrates.
The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products.
This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
| Standards | Relationship |
| IEC TS 62878-2-3:2015 | Identical |
| IEC 62421:2007 | Electronics assembly technology - Electronic modules |
| IEC TS 62878-2-1:2015 | Device embedded substrate - Part 2-1: Guidelines - General description of technology |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
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