PD IEC/TS 62878-2-4:2015
Current
The latest, up-to-date edition.
Device embedded substrate Guidelines. Test element groups (TEG)
Hardcopy , PDF
English
30-04-2015
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test conditions and sample preparation
5 TEG
Bibliography
Defines the test element group devices useful when measuring basic properties of device embedded substrates.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded substrates.
This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
| Standards | Relationship |
| IEC TS 62878-2-4:2015 | Identical |
| IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
| IEC TS 62878-2-1:2015 | Device embedded substrate - Part 2-1: Guidelines - General description of technology |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.