PREN ISO 9455-16 : DRAFT 2011

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD

Available format(s):

Superseded date: 01-04-2013

Language(s):

Published date: 12-01-2013

Publisher: Comite Europeen de Normalisation

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Table of Contents - (Show below) - (Hide below)

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 Principle
6 Reagents
7 Apparatus
8 Test pieces
9 Procedure
10 Reference value using standard flux
11 Presentation of results
12 Expression of results
13 Test report
Annex A (normative) - Method for the preparation
        of standard reference rosin (colophony) based
        liquid fluxes having 25% (m/m) non-volatile
        content
Annex B (normative) - Method for the production
        of a controlled contaminated surface sample
        for the wetting balance test
        (artificial sulfidation method)

Abstract - (Show below) - (Hide below)

Describes a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method.

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Comment Closes On
Committee	TC 121
Document Type	Draft
ISBN
Pages
Published
Publisher	Comite Europeen de Normalisation
Status	Superseded
Superseded By	EN ISO 9455-16:2013

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Equivalent Standard(s)	Relationship
11/30213136 DC : 0	Identical

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 1634-1:1987	Wrought copper and copper alloy plate, sheet and strip Part 1: Technical conditions of delivery for plate, sheet and strip for general purposes
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
ISO 9453:2014	Soft solder alloys Chemical compositions and forms

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