S.R. TR 62258-7:2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
Hardcopy , PDF
English
14-01-2008
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 General
5 Data exchange
Annex A (normative) XML schema
Annex B (informative) XML example
Bibliography
IEC/TR 62258-7, which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers.
Committee |
TC 47
|
DocumentType |
Standard Recommendation
|
ISBN |
2-8318-9289-9
|
Pages |
35
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Current
|
Standards | Relationship |
CLC/TR 62258-7:2007 | Identical |
IEC TR 62258-7:2007 | Identical |
EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
EN 62258-6 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
EN 62258-5 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
CLC/TR 62258-4:2013 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
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