SEMI G68 : 1996(R2018)
Current
The latest, up-to-date edition.
TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES
12-01-2013
Determines thermal resistance of semiconductor packages using thermal test chips. Method deals with junction-to-case measurements of thermal resistance in an air environment. Results of this test method are used to obtain the junction temperature. Measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G43 : 1987(R2011) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF MOLDED PLASTIC PACKAGES |
| SEMI G32 : 1994(R2011) | GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP |
| SEMI G30 : 1988(R2011) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.