SEMI HB2 : 2013(R2018)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR 150 MM OPEN PLASTIC AND METAL WAFER CASSETTES INTENDED FOR USE FOR MANUFACTURING HB-LED DEVICES
Published date
28-07-2013
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Gives the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB-LED sapphire wafers conforming to the SEMI standard.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (07/2013)
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| DocumentType |
Revision
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI HB3 : 2016 | SPECIFICATION FOR THE MECHANICAL INTERFACE FOR 150 MM HB-LED LOAD PORT |
| SEMI HB1 : 2016 | SPECIFICATION FOR SAPPHIRE WAFERS INTENDED FOR USE FOR MANUFACTURING HIGH BRIGHTNESS-LIGHT EMITTING DIODE DEVICES |
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