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SEMI HB2 : 2013(R2018)

SEMI HB2 : 2013(R2018)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR 150 MM OPEN PLASTIC AND METAL WAFER CASSETTES INTENDED FOR USE FOR MANUFACTURING HB-LED DEVICES

Published date

28-07-2013

Publisher

Semiconductor Equipment & Materials Institute

Gives the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB-LED sapphire wafers conforming to the SEMI standard.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (07/2013)
DocumentType
Revision
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI HB3 : 2016 SPECIFICATION FOR THE MECHANICAL INTERFACE FOR 150 MM HB-LED LOAD PORT

SEMI HB1 : 2016 SPECIFICATION FOR SAPPHIRE WAFERS INTENDED FOR USE FOR MANUFACTURING HIGH BRIGHTNESS-LIGHT EMITTING DIODE DEVICES

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