SEMI M48 : 2001
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
GUIDE FOR EVALUATING CHEMICAL-MECHANICAL POLISHING PROCESSES OF FILMS ON UNPATTERNED SILICON SUBSTRATES
01-11-2010
12-01-2013
Provides a guide for evaluation of chemical-mechanical polishing (CMP) processes of thin films on unpatterned silicon substrates and includes recommended procedures for process testing and reporting formats.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (11/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Withdrawn
|
| SEMI M20 : 2015 | PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM |
| SEMI E89 : 2007(R2013) | GUIDE FOR MEASUREMENT SYSTEM ANALYSIS (MSA) |
| SEMI M11 : 2004 | SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS FOR INTEGRATED CIRCUIT (IC) APPLICATIONS |
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