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SEMI M77 : 2015

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY USING ROLL-OFF AMOUNT, ROA

Superseded date

07-06-2021

Superseded by

SEMI M77 : 2021

Published date

12-01-2013

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Includes calculation of the near-edge geometry metric roll-off amount (ROA).

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (12/2010)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI M68 : MAR 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD
SEMI M70 : 2015 TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS
SEMI M67 : 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS
SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS

SEMI M59 : 2014 TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI M20 : 2015 PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM
SEMI M67 : 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS
SEMI M70 : 2015 TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS
SEMI M68 : MAR 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD

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