SEMI M77 : 2015
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY USING ROLL-OFF AMOUNT, ROA
Superseded date
07-06-2021
Superseded by
Published date
12-01-2013
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Includes calculation of the near-edge geometry metric roll-off amount (ROA).
DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (12/2010)
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DocumentType |
Standard
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PublisherName |
Semiconductor Equipment & Materials Institute
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Status |
Superseded
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SupersededBy |
SEMI M68 : MAR 2015 | TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD |
SEMI M70 : 2015 | TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS |
SEMI M67 : 2015 | TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS |
SEMI M1 : 2017 | SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS |
SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
SEMI M20 : 2015 | PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM |
SEMI M67 : 2015 | TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS |
SEMI M70 : 2015 | TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS |
SEMI M68 : MAR 2015 | TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD |
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