SEMI MF1390 : 2018
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TEST METHOD FOR MEASURING BOW AND WARP ON SILICON WAFERS BY AUTOMATED NONCONTACT SCANNING
Superseded date
04-11-2023
Superseded by
Published date
12-01-2013
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Contains a noncontacting, nondestructive procedure to determine the bow and warp of clean, dry semiconductor wafers.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (11/2003)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Superseded
|
| SupersededBy |
| SEMI M23:2023 | Specification for Polished Monocrystalline Indium Phosphide Wafers |
| SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
| SEMI MF1530 : 2007(R2018) | TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI M20 : 2015 | PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM |
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