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SN EN 123300 : AMD 1 1995

SN EN 123300 : AMD 1 1995

Current

Current

The latest, up-to-date edition.

SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS

Published date

12-01-2013

Publisher

Swiss Standards

Foreword
Preface
1. Introduction
1.1 Scope and object
1.2 Related documents
2. General
3. Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
4. Relevant specification
5. Characteristics of printed boards
      Table I
      Table II
6. Capability test programme
7. Quality conformance inspection
8. Test patterns
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Structure of test boards
8.4 Multiple arrangements of the CTP
Figure 2 - Composite test pattern
Figure 3 - Examples of soldered holes

Applies to multilayer printed boards regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
BS EN 123300:1992 Identical
EN 123300 : 1992 AMD 1 1995 Identical
DIN EN 123300:1992-11 Identical
I.S. EN 123300:1994 Identical

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