SN EN 60068-2-58 : 1999

1 Scope and object
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes using lead-free solder
   alloys
5 Preconditioning
6 Solder bath method
   6.1 Test apparatus and materials for the solder bath
       method
   6.2 Test procedure for solder bath method
7 Solder reflow methods
   7.1 Test apparatus and materials for solder reflow
       methods
   7.2 Test procedure for the solder reflow method
8 Test conditions
   8.1 Test conditions for lead-free solder alloys
   8.2 Test conditions for lead containing solder alloy
9 Final measurements
   9.1 Flux removal
   9.2 Recovery conditions
   9.3 Evaluation
10 Information to be given in the relevant specification
Annex A (normative) Criteria for visual examination
Annex B (informative) Guidance
Annex C (informative) Quick view of the test conditions
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications
Bibliography
Figures
Tables

Describes Test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. It also provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.