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SN EN 61249-8-8 : 1997

Current

Current

The latest, up-to-date edition.

MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS

Published date

12-01-2013

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Gives requirements for qualification of temporary solder resist coatings, known as masks as they are easily removable. Peelable solder masks are for screen printing to areas of a completed printed board or panel before shipment, so as to protect areas of the board or panel during processes by the board assembler. Mainly used for protection of keypad contacts during fluxing and mass soldering.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
BS EN 61249-8-8:1997 Identical
UNE-EN 61249-8-8:2000 Identical
I.S. EN 61249-8-8:1999 Identical
EN 61249-8-8:1997 Identical
IEC 61249-8-8:1997 Identical
DIN EN 61249-8-8:1998-01 Identical

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