• SN EN 61760-1 : 1998

    Current The latest, up-to-date edition.

    SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)

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    Published date:  12-01-2013

    Publisher:  Swiss Standards

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Definitions
    4 General requirements
        4.1 Contents of specifications
        4.2 Declaration of soldering process suitability
        4.3 Packaging and packaging marking
        4.4 Component marking
        4.5 Storage
        4.6 Component outline
        4.7 Mechanical stress
        4.8 Ordering information
    5 Identification of assembly process conditions
        5.1 General
        5.2 Placement
        5.3 Securing the component on the substrate prior to
              soldering
        5.4 Soldering methods
        5.5 Cleaning (if applicable)
        5.6 Removal and/or replacement of SMDs
        5.7 Special handling conditions
    6 Reference conditions
        6.1 Soldering processes, temperature/time profiles
        6.2 Classification
        6.3 Reference set of assembly cleaning conditions
    7 Tests
        7.1 General
        7.2 Soldering
        7.3 Resistance to mechanical forces
        7.4 Resistance to cleaning solvent
    Tables
    1 SMD classification related to tests and soldering
        processes
    2 Basic cleaning procedures
    3 Immersion conditions related to processes to be
        simulated
    4 Immersion conditions for solderability (wetting and
        dewetting) and dissolution of metallization
    Figures
    1 Manufacturing steps
    2 Vapour phase soldering, batch system with preheating -
        Temperature/time profile (terminal temperature)
    3 Vapour phase soldering, in-line system with preheating -
        Temperature/time profile (terminal temperature)
    4 Infrared soldering, forced gas convection soldering -
        temperature/time profile (terminal temperature)
    5 Double wave soldering - Temperature/time profile (terminal
        temperature)
    A.1 Examples of immersion for solderability testing
    A.2 Components with gull-wing leads
    A.3 Components with J-leads
    A.4 Cubic or cylindrical components
    A.5 Components with rectangular leads
    A.6 Components with butt leads
    Annex A (normative) Test methods for soldering
    Annex ZA Normative references to international publications
    with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

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    Document Type Standard
    Publisher Swiss Standards
    Status Current
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