UNE-EN 60191-6-21:2010
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorsed by AENOR in February of 2011.)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-02-2011
Publisher
Committee |
CTN 209/SC 47
|
DocumentType |
Standard
|
Pages |
18
|
PublisherName |
Asociacion Espanola de Normalizacion
|
Status |
Current
|
Standards | Relationship |
IEC 60191-6-21:2010 | Identical |
EN 60191-6-21 : 2010 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.