UNE-EN ISO 9455-14:2018
Current
The latest, up-to-date edition.
Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
Hardcopy , PDF
English, Spanish, Castilian
07-03-2018
This part of ISO 9455 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes andflux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
| Committee |
CTN 14
|
| DevelopmentNote |
Supersedes UNE EN 29455-14. (04/2018)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| EN ISO 9455-14:2017 | Identical |
| ISO 9455-14:2017 | Identical |
| ISO 197-1:1983 | Copper and copper alloys — Terms and definitions — Part 1: Materials |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| ISO 9453:2014 | Soft solder alloys — Chemical compositions and forms |
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