09/30206176 DC : DRAFT JUNE 2009
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
31-03-2012
23-11-2012
1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable test method
4.1 Stress to solder joints in the field and test
methods
4.2 Selection of test methods based on the shapes
and terminals of electronic devices
4.2.1 Surface mount devices
4.2.2 Insertion component (leaded device)
5 Common subjects in each test method
5.1 Mounting device and materials used
5.2 Soldering condition
5.2.1 Other specifications
5.3 Accelerated stress test
5.3.1 Rapid temperature change test (apply to all
solder alloy in this document)
5.3.2 High temperature test
Bi58Sn42 alloy solder only)
5.3.3 High temperature and High humidity test
(constant)
to Sn91Zn9 and Sn89Zn8Bi3 alloy solder)
6 Evaluation test method
6.1 Solder joint strength test of SMD before and
after the rapid temperature change test
6.1.1 Pull strength test
6.1.2 Shear strength test for force applied to the
side of a specimen
6.1.3 Torque shear strength test
6.1.4 Monotonic bending strength test
6.2 Cyclic bending strength test
6.3 Mechanical shear fatigue test
6.4 Cyclic drop test
6.4.1 Cyclic drop test
6.4.2 Cyclic steel ball drop strength test
6.5 Strength test of leaded device
6.5.1 Pull strength test of leaded device
6.5.2 Creep strength test of leaded device
Annex A (Informative) - Condition of rapid temperature change
test
Annex B (Informative) - Solder joint test by electrical
conduction
Annex C (Informative) - Torque shear strength test
Annex D (Informative) - Monotonic bending strength test
Annex E (Informative) - Cyclic steel ball drop strength test
Annex F (Informative) - Pull strength test
Annex G (Informative) - Creep strength test
Annex H (Informative) - Fillet lifting phenomenon observation
of leaded device solder joint and the life test by
electrical conduction
BS EN 62137-3 ED.1
| Committee |
EPL/501
|
| DocumentType |
Draft
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| IEC 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 62137-1-1:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
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