BS IEC 61189-5-4 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
12/30274796 DC : 0
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BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
BS EN 61192-1:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
CEI EN 61189-5-2 : 2016
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 60068-2-69:2017
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
I.S. EN 61192-1:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
IEC 61189-5-2:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
14/30309696 DC : 0
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BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
BS EN 61191-1:2013
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Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
EN 60068-3-13:2016
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Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
EN 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
EN 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
EN 62137:2004/corrigendum:2005
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ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
EN 61189-5-3:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
BS EN 62326-20:2016
|
Printed boards Printed circuit boards for high-brightness LEDs |
09/30206176 DC : DRAFT JUNE 2009
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BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
BS EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
07/30165180 DC : 0
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BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
11/30243259 DC : 0
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BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
BS EN 62137-1-1:2007
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Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test |
12/30274800 DC : 0
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BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
IEC 61190-1-3:2017
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
CEI EN 60068-2-58 : 2016
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN 61192-5:2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
VDE 0468-2-69 : 2018
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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
NF EN 61189-5 : 2008
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
I.S. EN IEC 61190-1-3:2018
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
IEC PAS 62137-3:2008
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Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints |
I.S. EN 61190-1-3:2007
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
BS EN 61189-5-1:2016
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 61189-5-4:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
IEC 62137:2004
|
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
14/30309692 DC : 0
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BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
BS EN 62137:2004
|
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
BS EN 61189-6:2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
15/30318681 DC : 0
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BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
DD IEC PAS 62137-3 : DRAFT 2008
|
ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
BS EN 61189-5-4:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
BS EN 61190-1-2:2014
|
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly |
BS EN 61189-5-2:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
BS IEC 61189-5-3 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
05/30133283 DC : DRAFT MAY 2005
|
IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
BS EN 60068-2-54:2006
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
BS EN 61189-5-3:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
EN 60068-2-69:2017/AC:2018-03
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
BS EN 61190-1-3 : 2007
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
I.S. EN 61190-1-2:2014
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
I.S. EN 61189-5:2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
NF EN 61190-1-3 : 2008 AMD 1 2010
|
Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
I.S. EN 60068-2-54:2006
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
I.S. EN 61189-3:2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
IEC 61189-5:2006
|
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
IEC 62137-4:2014
|
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
BS EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
BS EN 62137-4:2014
|
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
12/30274804 DC : 0
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BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
BS EN 60068-3-13:2016
|
Environmental testing Supporting documentation and guidance on Test T. Soldering |
05/30133287 DC : DRAFT MAY 2005
|
IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
I.S. EN 60068-3-13:2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
I.S. EN 61189-5-4:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
CEI EN 62137-1-1 : 2008
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
CEI EN 60068-2-54 : 2007
|
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
EN IEC 61190-1-3:2018
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
DIN EN 60068-2-69 : 2007
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
I.S. EN 62137:2005
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
I.S. EN 61189-6:2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
IEC 61189-6:2006
|
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61189-5-3:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
IEC 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 61192-5:2007
|
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
IEC 60068-3-13:2016
|
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
IEC 62137-1-1:2007
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
EN 62137-1-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
12/30271778 DC : 0
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BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
I.S. EN 62137-4:2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 61189-3:2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
BS EN 61192-5:2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
BS IEC 61189-5-2 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
IEC 60068-2-69:2017
|
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
BS EN 60068-2-69:2017
|
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
12/30258438 DC : 0
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BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
I.S. EN 62137-1-1:2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
I.S. EN 61189-5-3:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 62326-20:2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
I.S. EN 61189-5-2:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 60068-2-58:2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
IEC 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 62326-20:2016
|
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
IEC 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
EN 61192-5 : 2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 61189-5-2:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
EN 62326-20:2016
|
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
EN 62137-4:2014/AC:2015
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
EN 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
EN 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
EN 61189-5 : 2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
EN 60068-2-58:2015/A1:2018
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
EN 61189-3:2008
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |