• ARINC 669 : 2004

    Current The latest, up-to-date edition.

    GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  12-11-2004

    Publisher:  Aeronautical Radio Inc.

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    Table of Contents - (Show below) - (Hide below)

    1.0 INTRODUCTION
    1.1 Introduction
    1.2 Overview and Background
    1.3 Scope
    1.4 Goals
    1.5 Documents
    2.0 SOLDERING GUIDANCE FOR REPAIR
        AND REWORK PROCESSES
    2.1 Introduction
    2.2 General
    2.3 Materials and Processes
    2.4 Tools
    2.5 Typical Soldering Program
    2.6 Quality Assurance Provisions.
    3.0 ROLES AND RESPONSIBILITIES
    3.1 Introduction
    3.2 Airframe/Engine Manufacturer
    3.3 Component/Piece Part Manufacturer
    3.4 Maintenance and Repair Organizations (MRO)
    4.0 DOCUMENTATION REQUIREMENTS
    4.1 Introduction
    4.2 Manufacturers Service Documents
    4.3 MROs Soldering Program Documents
    APPENDICES
    A List of Acronyms
    ARINC Standard - Errata Report
    ARINC IA Project Initiation/Modification (APIM)

    Abstract - (Show below) - (Hide below)

    Gives guidance for using industry standards for developing a soldering program tailored to meet the specific requirements of the user.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Aeronautical Radio Inc.
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 7721 : 1998 REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
    IPC 7711 : 1998 REWORK OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    ARINC 670 : 2005 GUIDANCE FOR MATERIALS, PROCESSES, AND PARTS EQUIVALENCIES
    IPC WHMA A 620 : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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