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BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
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Available format(s): Hardcopy, PDF
Withdrawn date: 09-06-2016
Language(s): English
Published date: 26-04-1994
Publisher: National Standards Authority of Ireland
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.Only cited Standards give presumption of conformance to New Approach Directives/Regulations.Dates of withdrawal of national standards are available from NSAI.
FOREWORDPREFACEScope1. General 1.1 Standard atmospheric conditions 1.2 Precision of timing and measurements 1.3 Test specimens2. Electrical tests 2.0 Precautions to be taken in certain electrical tests 2.1 Resistance of foil 2.2 Surface resistance after damp heat steady state 2.3 Volume resistivity after damp heat steady state 2.4 Surface corrosion 2.5 Corrosion at the edge 2.6 Comparative tracking index 2.7 Permittivity and dissipation factor after damp heat and recovery 2.8 Electric strength normal to plane of sheet 2.9 Properties of insulation at elevated temperature3. Non-electrical tests on metal-clad materials 3.1 Bow 3.2 Bow after heating 3.3 Twist 3.4 Twist after heating 3.5 Pull-off strength 3.6 Peel strength 3.7 Blistering after heat shock 3.8 Punching and machining 3.9 Surface finish 3.10 Solderability 3.11 Dimensional stability 3.12 Flexural fatigue 3.13 Mass per unit area of metal foil after lamination (by etching) 3.14 Thickness4. Non-electrical tots on the base material 4.1 Flexural strength 4.2 No test is assigned to this sub-clause 4.3 Flammability 4.4 Water absorptionAnnex ZA (normative) Other international publications quoted in this standard with the references of the relevant European publications
Describes methods for testing electrical, mechanical and other properties of base materials in sheet or roll form for application in the field of printed circuits irrespective of the nature of the base material.
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