• ASTM F 416 : 1994

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Test Method for Detection of Oxidation Induced Defects in Polished Silicon Wafers (Withdrawn 1998)

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    Superseded date:  18-02-2021

    Language(s): 

    Published date:  31-12-2010

    Publisher:  American Society for Testing and Materials

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    Abstract - (Show below) - (Hide below)

    CONTAINED IN VOL 10.05 1997 Detects crystalline defects in surface region of silicon wafers induced or enhanced by oxidation cycles in device processing. Includes atmospheric pressure oxidation cycles representative of bipolar, MOS and CMOS technologies. Reveals strain fields arising from precipitates, dislocations, oxidation induced or pre-existing stacking faults, and shallow etch pits.

    General Product Information - (Show below) - (Hide below)

    Document Type Test Method
    Publisher American Society for Testing and Materials
    Status Superseded

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-STD-989 Base Document:1991 CERTIFICATION REQUIREMENTS FOR JAN SEMICONDUCTOR DEVICES
    ASTM F 47 : 1994 Test Method for Crystalographic Perfection of Silicon by Preferential Etch Techniques (Withdrawn 1998)

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM F 612 : 1988 Practice for Cleaning Surfaces of Polished Silicon Slices (Withdrawn 1993)
    FED-STD-209 Revision E:1992 AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
    ASTM F 47 : 1994 Test Method for Crystalographic Perfection of Silicon by Preferential Etch Techniques (Withdrawn 1998)
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