BS 2011-2.1Z/AD:1977
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing. Tests Tests Z/AD. Composite temperature/humidity cyclic test
Hardcopy , PDF
15-09-1999
English
31-08-1977
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Foreword
Clause
1. Introduction
2. Object
3. General description of the test
4. Description of test apparatus
5. Severities
6. Testing procedure
7. Information to be given in the relevant
specification
Figures
Composite test procedure for component type specimens to determine in an accelerated manner their resistance to deteriorative effects of high temperature/humidity and cold conditions.
| Committee |
GEL/104
|
| DevelopmentNote |
Implements CENELEC HD 323.2.38
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60068-2-38:2009 | Identical |
| BS CECC 20000:1983 | Harmonized system of quality assessment for electronic components: generic specification: semiconductor optoelectronic and liquid crystal devices |
| BS 6221-11:1991 | Printed wiring boards Specification for flex-rigid multilayer printed boards with through connections |
| BS EN 61249-8-7:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks |
| BS 2011-1.1:1983 | Environmental testing General and guidance |
| BS EN 123800:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections |
| BS EN 120000:1996 | Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices |
| BS AU 217-2:1989 | Maximum road speed limiters for motor vehicles Specification for system and component requirements |
| BS 4584-103.3:1992 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| BS EN 123600:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections |
| BS 6221-9:1991 | Printed wiring boards Specification for flexible multilayer boards with through connections |
| BS QC 960000:1992 | Harmonized system of quality assessment for electronic components. Electromechanical switches for use in electronic equipment. Generic specification |
| BS 6221-10:1991 | Printed wiring boards Specification for flex-rigid double-sided printed boards with through connections |
| BS EN 123700:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections |
| BS 2011-2.2C & D:1981 | Environmental testing. Guidance Tests C & D. Guidance for damp heat tests |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
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