BS 3934-6:1992
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
Hardcopy , PDF
18-02-2005
English
01-04-1992
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Committees responsible
National foreword
Specification
1. Scope
2. Definitions
3. Design rules
Tables - Dimensions to be specified
Notes to the tables
4. Illustration of the rules
5. Recommended values
Figures
Appendices
A1. Drawing of leaded packages with two parallel rows of
terminals
A2. Drawing of leaded packages with one row of terminals
on each of the four sides
A3. Drawing of folded lead packages with one row of
terminals on each of the four sides
A4. Drawing of leadless packages
B1. Recommended values for leaded packages with two
parallel rows of terminals, original dimensions:
inches
Provides rules for preparation of outline drawings of surface-mounted semiconductor devices. Supplements IEC Publications and 191-1 & -3. Covers all surface-mounted devices - discrete semiconductors and integrated circuits - classified as form E in IEC Publication 191-4.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes BS 3934(1965). (10/2002) Supersedes BS 3934:ADD5(1983) (07/2004)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| BS CECC 00802:1994 | Harmonized system of quality assessment for electronic components. Guidance document: CECC Standard method for the specification of surface mounting components (SMDs) of assessed quality |
| BS 3934-3:1992 | Mechanical standardization of semiconductor devices Recommendations for the preparation of outline drawings of integrated circuits |
| BS 3934-4:1992 | Mechanical standardization of semiconductor devices Recommendations for a coding system and classification into forms of package outlines for semiconductor devices |
| BS 3934-1:1992 | Mechanical standardization of semiconductor devices Recommendations for the preparation of drawings of semiconductor devices |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| BS 3934-2(1992) : 1992 AMD 13374 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - SCHEDULE OF INTERNATIONAL DRAWINGS GIVING DIMENSIONS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.