BS EN 60191-6:2009
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Hardcopy , PDF
31-10-2022
English
30-04-2010
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1 Scope
2 Normative references
3 Terms and definitions
4 Design rules
5 Dimensions to be specified
6 Notes
Annex A (informative) - Illustration of the rules
Annex B (informative) - Optional table format
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Provides general rules for the preparation of outline drawings of surface-mounted semiconductor devices.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes BS 3934-6(1992) (02/2005) Supersedes 07/30167960 DC. (04/2010)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition:
a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;
b) editorial modifications on several pages; and
c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.
| Standards | Relationship |
| NBN EN 60191-6 : 2010 | Identical |
| I.S. EN 60191-6:2009 | Identical |
| IEC 60191-6:2009 | Identical |
| NF EN 60191-6 : 2011 | Identical |
| EN 61755-2-2 : 2006 | Identical |
| DIN EN 60191-6:2010-06 | Identical |
| EN 60191-6:2009 | Identical |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| ISO 2692:2014 | Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) |
| EN ISO 1101:2017 | Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2017) |
| ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| EN 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| EN ISO 2692:2014 | Geometrical product specifications (GPS) - Geometrical tolerancing - Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) (ISO 2692:2014) |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| EN 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
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