BS 6221-22:1990
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology
Hardcopy , PDF
01-03-2006
English
31-12-1990
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Committees responsible
Foreword
Guide
1. Scope
2. General
3. Introduction to base laminate materials
4. Material specifications
5. Phenolic resin based copper-clad laminates
6. Epoxide resin based copper-clad laminates
7. Polyimide resin based copper-clad laminates
8. Polyester resin based copper-clad laminates
9. Silicone resin based copper-clad laminates
10. Polytetrafluoroethylene (PTFE) resin based copper-
clad laminates
11. Compliant layer copper-clad laminates
12. Metallurgically bonded laminates
13. Ceramic base materials
14. Typical comparative material properties
Figures
1. Examples of a four multilayer board lay-up
2. Example of a six layer multilayer board lay-up
Tables
1. Comparative properties of phenolic resin and epoxide
resin based materials
2. Comparative properties of polyimide resin and
polyester resin based materials
3. Comparative properties of silicone resin and PTFE
resin based materials
4. Comparative properties of alumina, copper-clad invar,
copper-clad molybdenum and compliant layer materials
Guidance on the manufacture and properties of base laminate materials.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS 6221(1982) (07/2004) Supersedes 88/31464 DC (09/2005)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| BS 4584-102.4(1990) : 1990 AMD 8244 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE |
| BS 6221-20:1984 | Printed wiring boards Guide for the assembly of printed wiring boards |
| BS 6221-3:1984 | Printed wiring boards Guide for the design and use of printed wiring boards |
| BS 4584-102.13(1990) : 1990 AMD 8421 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE |
| BS 4584-102.12(1990) : 1990 AMD 8418 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPEC. FOR THIN EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN FABRICATION OF MULTILAYER BOARDS |
| BS 4584-102.2(1990) : 1990 AMD 8242 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET, ECONOMIC QUALITY |
| BS 6221-21:1984 | Printed wiring boards Guide for the repair of printed wiring boards |
| BS 4584-102.3(1990) : 1990 AMD 8243 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS SPECIFICATION FOR EPOXIDE CELLULOSE PAPER COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS 6221-8:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections |
| BS 4584-102.9(1990) : 1990 AMD 8411 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPECIFICATION FOR CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS 6221-6:1982 | Printed wiring boards Specification for multilayer printed wiring boards |
| BS 4584-102.1(1990) : 1990 AMD 8241 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY |
| BS 6221-5:1982 | Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes |
| BS 4584-102.14(1990) : 1990 AMD 8422 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - PART 102 - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) ECONOMIC QUALITY |
| BS 4584-102.5(1990) : 1990 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS 4584-102.6(1990) : 1990 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE PAPER COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (HORIZONTAL BURNING TEST) |
| BS 4584-102.11(1990) : 1990 AMD 8416 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPEC. FOR THIN EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEER, GENERAL PURPOSE GRADE, FOR USE IN FABRICATION OF MULTILAYER BOARDS |
| BS 4584-102.10(1990) : 1990 AMD 8419 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE NON WOVEN/WOVEN GLASS REINFORCED COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS 4584-102.7(1990) : 1990 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR PHENOLIC CELLULOSE COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS 4584-102.8(1990) : 1990 AMD 8417 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYESTER (PETP) FILM |
| BS 6221-7:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections |
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