BS CECC23300(1989) : 1989 AMD 7364
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
15-11-1992
23-11-2012
Applies to multilayer printed boards regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). BS AMD 7364 RENUMBERS THIS STANDARD TO BS EN 123300
| Committee |
ECL/19
|
| DevelopmentNote |
Renumbered and superseded by BS EN 123300. Supersedes 86/31650 DC. (09/2005)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CECC 23300 : 85 AMD 1 | Identical |
| CECC 23000 : 1985 | GENERIC SPECIFICATION: PRINTED BOARDS |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
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