BS EN 123200:1992
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
Hardcopy , PDF
English
29-09-1989
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Foreword
Preface
1. General
2. Capability qualifying component CQC
3. Capability approval
4. Capability testing
Characteristics test tables
Characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS CECC23200(1989). 1992 Version incorporates amendment 7361 to BS CECC23200(1989). Supersedes 86/31649 DC and 94/216046 DC. To be read in conjunction with BS CECC 23000(1989). (08/2005)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| SN EN 123200 : AMD 1 1995 | Identical |
| DIN EN 123200:1992-11 | Identical |
| NEN EN 123200 : 1995 AMD 1 1995 | Identical |
| EN 123200:1992/A1:1995 | Identical |
| CECC 23200 : 1985 | Identical |
| I.S. EN 123200:1994 | Identical |
| BS CECC 23200-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes |
| BS CECC 23300-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
| CECC 00107(PT3) : 80 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL |
| BS CECC23000(1989) : 1989 AMD 7145 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| BS 6221-5:1982 | Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes |
| CECC 00111 : 80 AMD 3 | CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| BS 2011(1967) : LATEST |
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