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BS EN 123600:1997

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections

Available format(s)

Hardcopy , PDF

Withdrawn date

13-10-2017

Language(s)

English

Published date

15-05-1997

€306.17
Excluding VAT

1 Introduction
    1.1 Scope and object
    1.2 Related documents
2 General
3 Test specimen
    3.1 Capability Approval
    3.2 Quality conformance inspection
4 Relevant specification
5 Characteristics of the printed board
    Table I Basic characteristics
    Table II Additional characteristics
6 Capability test programme
    Table III
7 Quality conformance inspection
    Table IV
8 Test pattern - Test boards
    8.1 General
    8.2 Application of test patterns and test boards
          Table V
    8.3 Structure of test boards
    8.4 Multiple arrangements of the composite test pattern
          8.4.1 Examples of multiple arrangements
                  Test board structure, Table VI
                  Figure 3a Layer 1
                  Figure 3b Layer 2
                  Figure 3c Layer 3
                  Figure 3d Layer 4
                  Figure 3e Layer 5
                  Figure 3f Layer 6
                  Figure 3g
                  Figure 3h
                  Figure 4a L specimen (layer 3, 3a, 3b)
                  Figure 4b L specimen (layer 4, 4a, 4b)
                  Figure 5 Examples of delamination
                  Figure 6a Methods of reinforcing lands
                  Figure 6b Examples relating to access
                              holes
                  Figure 7 Examples of soldered holes

Defines the characteristics to be assessed and the test methods to be used for capability testing and for quality conformity testing (lot-by-lot and periodic inspection).

Committee
EPL/501
DevelopmentNote
Supersedes BS 9766(1983) and 91/28661 DC. (08/2005)
DocumentType
Standard
Pages
50
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

Standards Relationship
DIN EN 123600:1997-10 Identical
SN EN 123600 : 1996 Identical
NEN EN 123600 : 1997 Identical
EN 123600:1996 Identical

BS CECC 23600-801:1998 Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

IEC 60097:1991 Grid systems for printed circuits
BS 2011-2.1Z/AD:1977 Environmental testing. Tests Tests Z/AD. Composite temperature/humidity cyclic test
BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
BS 6221-2:1991 Printed wiring boards Methods of test
BS 6221-3:1991 Printed wiring boards Guide for the design and use of printed wiring boards
BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
IEC 60326-11:1991 Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
BS 4727-1:GRP11(1991) : 1991 GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
IEC 60326-1:1984 Printed boards - Part 1: General information for the specification writer
BS 2011-2.1T:1981 Environmental testing. Tests Test T. Soldering

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