BS EN 123600:1997
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
Hardcopy , PDF
13-10-2017
English
15-05-1997
1 Introduction
1.1 Scope and object
1.2 Related documents
2 General
3 Test specimen
3.1 Capability Approval
3.2 Quality conformance inspection
4 Relevant specification
5 Characteristics of the printed board
Table I Basic characteristics
Table II Additional characteristics
6 Capability test programme
Table III
7 Quality conformance inspection
Table IV
8 Test pattern - Test boards
8.1 General
8.2 Application of test patterns and test boards
Table V
8.3 Structure of test boards
8.4 Multiple arrangements of the composite test pattern
8.4.1 Examples of multiple arrangements
Test board structure, Table VI
Figure 3a Layer 1
Figure 3b Layer 2
Figure 3c Layer 3
Figure 3d Layer 4
Figure 3e Layer 5
Figure 3f Layer 6
Figure 3g
Figure 3h
Figure 4a L specimen (layer 3, 3a, 3b)
Figure 4b L specimen (layer 4, 4a, 4b)
Figure 5 Examples of delamination
Figure 6a Methods of reinforcing lands
Figure 6b Examples relating to access
holes
Figure 7 Examples of soldered holes
Defines the characteristics to be assessed and the test methods to be used for capability testing and for quality conformity testing (lot-by-lot and periodic inspection).
Committee |
EPL/501
|
DevelopmentNote |
Supersedes BS 9766(1983) and 91/28661 DC. (08/2005)
|
DocumentType |
Standard
|
Pages |
50
|
PublisherName |
British Standards Institution
|
Status |
Withdrawn
|
Supersedes |
Standards | Relationship |
DIN EN 123600:1997-10 | Identical |
SN EN 123600 : 1996 | Identical |
NEN EN 123600 : 1997 | Identical |
EN 123600:1996 | Identical |
BS CECC 23600-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections |
IEC 60097:1991 | Grid systems for printed circuits |
BS 2011-2.1Z/AD:1977 | Environmental testing. Tests Tests Z/AD. Composite temperature/humidity cyclic test |
BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
BS 6221-2:1991 | Printed wiring boards Methods of test |
BS 6221-3:1991 | Printed wiring boards Guide for the design and use of printed wiring boards |
BS EN 123000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
IEC 60326-11:1991 | Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections |
BS 4727-1:GRP11(1991) : 1991 | GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS |
IEC 60326-1:1984 | Printed boards - Part 1: General information for the specification writer |
BS 2011-2.1T:1981 | Environmental testing. Tests Test T. Soldering |
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