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BS EN 160100:1998

Current

Current

The latest, up-to-date edition.

Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-02-1998

€271.12
Excluding VAT

FOREWORD
1 General
    1.1 Scope
    1.2 Related documents
    1.3 Units, symbols and terminology
          1.3.1 Printed circuit (IEC 194)
          1.3.2 Printed board (IEC 194)
          1.3.3 Printed board assembly (IEC 194)
          1.3.4 Pin-in-hole assembly (PIH)
          1.3.5 Surface mounting assembly
          1.3.6 Rework (RP14: Part III and 1.4)
          1.3.7 Rework (RP14: Part III and 1.5)
    1.4 Marking of the printed board assembly and
          package
2 Quality assessment procedures
    2.1 General
          2.1.1 Eligibility for capability approval
                  (subsection 2.1 RP 14: Part III)
          2.1.2 Primary stage of manufacture
          2.1.3 Structural similarity
          2.1.4 Subcontracting
          2.1.5 Incorporated components (subsection 2.3
                  RP 14: Part III)
          2.1.6 Validity of release
    2.2 Procedures for capability approval
          2.2.1 Application for capability approval
                  (subsection 2.4 RP 14: Part III)
          2.2.2 Granting of capability approval
          2.2.3 Description of capability (subsection
                  2.5 RP 14: Part III)
          2.2.4 Capability qualifying components (CQCs)
          2.2.5 Demonstration and verification of
                  capability
          2.2.6 Procedure to be followed in the event of
                  CQC failures (subsection 2.6 and
                  and subsection 2.10 RP 14: Part III)
          2.2.7 Abstract of description of capability
    2.3 Procedures following the granting of capability
          approval
          2.3.1 Maintenance of capability approval
                  (see subsection 2.9 of RP 14: Part III)
          2.3.2 Modifications likely to affect the validity
                  of the capability approval (subsection
                  2.11 of RP 14: Part III)
    2.4 Release for delivery
          2.4.1 Quality conformance inspection requirements
                  (subsection 3.1 of RP 14: Part III)
          2.4.2 Customer detail specification
          2.4.3 Detail specifications for standard
                  catalogue items to be included in the
                  qualified products list (QPL)
3 Test and measurement procedures
    3.1 Test and measurement conditions
          3.1.1 Standard atmospheric conditions for
                  testing and for electrical measurements
          3.1.2 Standard atmospheric conditions for
                  referee tests
    3.2 Measurement uncertainty
    3.3 Alternative test methods including the use of
          production tests
          3.3.1 Analogous tests
          3.3.2 Referee tersts
    3.4 Visual inspection
          3.4.1 General
          3.4.2 Mechanical component mounting acceptability
                  requirements
          3.4.3 Lead forming
          3.4.4 Component orientation and alignment
          3.4.5 Soldering acceptability - conventional
                  components and terminals
          3.4.6 Surface mount assemblies
          3.4.7 Soldering acceptability - surface mounted
                  components
          3.4.8 Cleanliness
          3.4.9 Conformal coatings and encapsulants
          3.4.10 Solder resists and markings
    3.5 Dimensioning and gauging
    3.6 Electrical test procedures
          3.6.1 Cleanliness testing
    3.7 Mechanical test procedures - see also 3.8
    3.8 Environmental and endurance testing and screening
          3.8.1 Temperature
          3.8.2 Damp heat, cyclic
          3.8.3 Shock
          3.8.4 Vibration (sinusoidal)
          3.8.5 Other tests
Annexes
A (informative) Sample flow chart and general plan for
    selection of CQCs
B (normative) Example layout of an abstract of description
    of capability for inclusion in CECC 00 200

Deals with printed board assemblies of assessed quality which meet criteria for a modular electronic unit as specified in the generic specification EN 160000. Applicable to both custom built products and to standard catalogue items, and specifies the characteristics for assessment and test procedures for use for capability approval, quality conformance inspection (lot-by-lot) and approval maintenance. SHOULD BE READ IN CONJUNCTION WITH EN 160000.

Committee
EPL/48
DevelopmentNote
Supersedes 93/205131 DC. (09/2005)
DocumentType
Standard
Pages
42
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
SN EN 160100 : 1997 Identical
EN 160100 : 1997 Identical
I.S. EN 160100:1998 Identical
NEN EN 160100 : 1997 Identical
DIN EN 160100:1998-04 Identical

CECC 00114-3 : 94 AMD 2 CAPABILITY APPROVAL OF AN ELECTRONIC COMPONENT MANUFACTURING ACTIVITY
CECC 00802 : 1994 GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING (SMDs) OF ASSESSED QUALITY
EN 123000:1991/A2:1996 GENERIC SPECIFICATION: PRINTED BOARDS
CECC 00803 : 1995 GUIDANCE DOCUMENT: VISUAL INSPECTION OF SOLDERED SURFACE MOUNTED ASSEMBLIES
EN 160000 : 93 AMD 1 95 GENERIC SPECIFICATION: MODULAR ELECTRONIC UNITS
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC 60589:1977 Methods of test for the determination of ionic impurities in electrical insulating materials by extraction with liquids
EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
CECC 00200 : 2002 REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS
EN 160101 : 1998 PRINTED BOARD ASSEMBLY MODULAR ELECTRONIC UNITS OF ASSESSED QUALITY- CAPABILITY APPROVAL (BLANK DETAIL SPECIFICATION)

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