BS EN 160100:1998
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
Hardcopy , PDF
English
15-02-1998
FOREWORD
1 General
1.1 Scope
1.2 Related documents
1.3 Units, symbols and terminology
1.3.1 Printed circuit (IEC 194)
1.3.2 Printed board (IEC 194)
1.3.3 Printed board assembly (IEC 194)
1.3.4 Pin-in-hole assembly (PIH)
1.3.5 Surface mounting assembly
1.3.6 Rework (RP14: Part III and 1.4)
1.3.7 Rework (RP14: Part III and 1.5)
1.4 Marking of the printed board assembly and
package
2 Quality assessment procedures
2.1 General
2.1.1 Eligibility for capability approval
(subsection 2.1 RP 14: Part III)
2.1.2 Primary stage of manufacture
2.1.3 Structural similarity
2.1.4 Subcontracting
2.1.5 Incorporated components (subsection 2.3
RP 14: Part III)
2.1.6 Validity of release
2.2 Procedures for capability approval
2.2.1 Application for capability approval
(subsection 2.4 RP 14: Part III)
2.2.2 Granting of capability approval
2.2.3 Description of capability (subsection
2.5 RP 14: Part III)
2.2.4 Capability qualifying components (CQCs)
2.2.5 Demonstration and verification of
capability
2.2.6 Procedure to be followed in the event of
CQC failures (subsection 2.6 and
and subsection 2.10 RP 14: Part III)
2.2.7 Abstract of description of capability
2.3 Procedures following the granting of capability
approval
2.3.1 Maintenance of capability approval
(see subsection 2.9 of RP 14: Part III)
2.3.2 Modifications likely to affect the validity
of the capability approval (subsection
2.11 of RP 14: Part III)
2.4 Release for delivery
2.4.1 Quality conformance inspection requirements
(subsection 3.1 of RP 14: Part III)
2.4.2 Customer detail specification
2.4.3 Detail specifications for standard
catalogue items to be included in the
qualified products list (QPL)
3 Test and measurement procedures
3.1 Test and measurement conditions
3.1.1 Standard atmospheric conditions for
testing and for electrical measurements
3.1.2 Standard atmospheric conditions for
referee tests
3.2 Measurement uncertainty
3.3 Alternative test methods including the use of
production tests
3.3.1 Analogous tests
3.3.2 Referee tersts
3.4 Visual inspection
3.4.1 General
3.4.2 Mechanical component mounting acceptability
requirements
3.4.3 Lead forming
3.4.4 Component orientation and alignment
3.4.5 Soldering acceptability - conventional
components and terminals
3.4.6 Surface mount assemblies
3.4.7 Soldering acceptability - surface mounted
components
3.4.8 Cleanliness
3.4.9 Conformal coatings and encapsulants
3.4.10 Solder resists and markings
3.5 Dimensioning and gauging
3.6 Electrical test procedures
3.6.1 Cleanliness testing
3.7 Mechanical test procedures - see also 3.8
3.8 Environmental and endurance testing and screening
3.8.1 Temperature
3.8.2 Damp heat, cyclic
3.8.3 Shock
3.8.4 Vibration (sinusoidal)
3.8.5 Other tests
Annexes
A (informative) Sample flow chart and general plan for
selection of CQCs
B (normative) Example layout of an abstract of description
of capability for inclusion in CECC 00 200
Deals with printed board assemblies of assessed quality which meet criteria for a modular electronic unit as specified in the generic specification EN 160000. Applicable to both custom built products and to standard catalogue items, and specifies the characteristics for assessment and test procedures for use for capability approval, quality conformance inspection (lot-by-lot) and approval maintenance. SHOULD BE READ IN CONJUNCTION WITH EN 160000.
Committee |
EPL/48
|
DevelopmentNote |
Supersedes 93/205131 DC. (09/2005)
|
DocumentType |
Standard
|
Pages |
42
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Standards | Relationship |
SN EN 160100 : 1997 | Identical |
EN 160100 : 1997 | Identical |
I.S. EN 160100:1998 | Identical |
NEN EN 160100 : 1997 | Identical |
DIN EN 160100:1998-04 | Identical |
CECC 00114-3 : 94 AMD 2 | CAPABILITY APPROVAL OF AN ELECTRONIC COMPONENT MANUFACTURING ACTIVITY |
CECC 00802 : 1994 | GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING (SMDs) OF ASSESSED QUALITY |
EN 123000:1991/A2:1996 | GENERIC SPECIFICATION: PRINTED BOARDS |
CECC 00803 : 1995 | GUIDANCE DOCUMENT: VISUAL INSPECTION OF SOLDERED SURFACE MOUNTED ASSEMBLIES |
EN 160000 : 93 AMD 1 95 | GENERIC SPECIFICATION: MODULAR ELECTRONIC UNITS |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC 60589:1977 | Methods of test for the determination of ionic impurities in electrical insulating materials by extraction with liquids |
EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
CECC 00200 : 2002 | REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS |
EN 160101 : 1998 | PRINTED BOARD ASSEMBLY MODULAR ELECTRONIC UNITS OF ASSESSED QUALITY- CAPABILITY APPROVAL (BLANK DETAIL SPECIFICATION) |
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