FOREWORD
1 General
1.1 Scope
1.2 Related documents
1.3 Units, symbols and terminology
1.3.1 Printed circuit (IEC 194)
1.3.2 Printed board (IEC 194)
1.3.3 Printed board assembly (IEC 194)
1.3.4 Pin-in-hole assembly (PIH)
1.3.5 Surface mounting assembly
1.3.6 Rework (RP14: Part III and 1.4)
1.3.7 Rework (RP14: Part III and 1.5)
1.4 Marking of the printed board assembly and
package
2 Quality assessment procedures
2.1 General
2.1.1 Eligibility for capability approval
(subsection 2.1 RP 14: Part III)
2.1.2 Primary stage of manufacture
2.1.3 Structural similarity
2.1.4 Subcontracting
2.1.5 Incorporated components (subsection 2.3
RP 14: Part III)
2.1.6 Validity of release
2.2 Procedures for capability approval
2.2.1 Application for capability approval
(subsection 2.4 RP 14: Part III)
2.2.2 Granting of capability approval
2.2.3 Description of capability (subsection
2.5 RP 14: Part III)
2.2.4 Capability qualifying components (CQCs)
2.2.5 Demonstration and verification of
capability
2.2.6 Procedure to be followed in the event of
CQC failures (subsection 2.6 and
and subsection 2.10 RP 14: Part III)
2.2.7 Abstract of description of capability
2.3 Procedures following the granting of capability
approval
2.3.1 Maintenance of capability approval
(see subsection 2.9 of RP 14: Part III)
2.3.2 Modifications likely to affect the validity
of the capability approval (subsection
2.11 of RP 14: Part III)
2.4 Release for delivery
2.4.1 Quality conformance inspection requirements
(subsection 3.1 of RP 14: Part III)
2.4.2 Customer detail specification
2.4.3 Detail specifications for standard
catalogue items to be included in the
qualified products list (QPL)
3 Test and measurement procedures
3.1 Test and measurement conditions
3.1.1 Standard atmospheric conditions for
testing and for electrical measurements
3.1.2 Standard atmospheric conditions for
referee tests
3.2 Measurement uncertainty
3.3 Alternative test methods including the use of
production tests
3.3.1 Analogous tests
3.3.2 Referee tersts
3.4 Visual inspection
3.4.1 General
3.4.2 Mechanical component mounting acceptability
requirements
3.4.3 Lead forming
3.4.4 Component orientation and alignment
3.4.5 Soldering acceptability - conventional
components and terminals
3.4.6 Surface mount assemblies
3.4.7 Soldering acceptability - surface mounted
components
3.4.8 Cleanliness
3.4.9 Conformal coatings and encapsulants
3.4.10 Solder resists and markings
3.5 Dimensioning and gauging
3.6 Electrical test procedures
3.6.1 Cleanliness testing
3.7 Mechanical test procedures - see also 3.8
3.8 Environmental and endurance testing and screening
3.8.1 Temperature
3.8.2 Damp heat, cyclic
3.8.3 Shock
3.8.4 Vibration (sinusoidal)
3.8.5 Other tests
Annexes
A (informative) Sample flow chart and general plan for
selection of CQCs
B (normative) Example layout of an abstract of description
of capability for inclusion in CECC 00 200