BS EN 16602-70-10:2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Space product assurance. Qualification of printed circuit boards
Hardcopy , PDF
19-07-2019
English
28-02-2015
Foreword
1 Scope
2 Normative references
3 Terms, definitions and
abbreviated terms
4 Principles
5 Evaluation
6 Qualification
7 Tests
8 Quality assurance for manufacturing
9 Requirements for PCBs
Annex A (normative) - Evaluation test report - DRD
Annex B (normative) - Qualification test report - DRD
Annex C (normative) - PCB manufacturing/assembly
process identification document (PID) - DRD
Annex D (normative) - Qualification status report - DRD
Annex E (informative) - Example of check-list
Annex F (informative) - Example of plated-through
hole microsection
Bibliography
Describes the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs.
Committee |
ACE/68
|
DocumentType |
Standard
|
Pages |
94
|
PublisherName |
British Standards Institution
|
Status |
Superseded
|
SupersededBy |
This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following type of PCBs: - Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated multilayer, metal core) - Flexible PCB (single-sided and double-sided) - Rigid-flex PCBs (multilayer and sequential-laminated multilayer) - High frequency PCBs - Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.
Standards | Relationship |
EN 16602-70-10:2015 | Identical |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 16602-70-21:2014 | Space product assurance - Flammability testing for the screening of space materials |
IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
EN 16602-70-29:2014 | Space product assurance - Determination of offgassing products from materials and assembled articles to be used in a manned space vehicle crew compartment |
IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
EN 16601-00-01:2015 | Space systems - Glossary of terms |
EN 16602-10-09:2014 | Space product assurance - Nonconformance control system |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
IEC 60326-11:1991 | Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections |
EN 16602-70-22:2014 | Space product assurance - Control of limited shelf-life materials |
EN 16602-70-08:2015 | Space product assurance - Manual soldering of high-reliability electrical connections |
EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 16602-70-02:2014 | Space product assurance - Thermal vacuum outgassing test for the screening of space materials |
EN 16602-20:2014 | Space product assurance - Quality assurance |
MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
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