BS EN 171000:2001
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Harmonized system of quality assessment for electronic components. Generic specification. Filters using waveguide type dielectric resonators
Hardcopy , PDF
10-03-2005
English
21-09-2001
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1 General
1.1 Scope
1.2 Normative references
1.3 Units, symbols and terminology
1.4 Preferred ratings and characteristics
1.5 Marking
1.6 Order of precedence
2 Quality Assessment Procedures
2.1 Primary stage of manufacture
2.2 Structurally similar components
2.3 Sub-contracting
2.4 Incorporated components
2.5 Manufacturers approval
2.6 Approval procedures
2.7 Procedures for Capability Approval
2.8 Procedures for Qualification Approval
2.9 Test procedures
2.10 Screening requirements
2.11 Rework and repair work
2.12 Certified test records
2.13 Validity of release
2.14 Release for delivery
2.15 Unchecked parameters
3 Test and measurement procedures
3.1 General
3.2 Test and measurement conditions
3.3 Visual inspection
3.4 Dimension and gauging procedure
3.5 Electrical test procedures
3.6 Mechanical and environmental test procedures
Applicable to filters using waveguide type dielectric resonators of assessed quality using either capability approval or qualification approval procedures.
| Committee |
W/-
|
| DevelopmentNote |
Supersedes 99/205366 DC (10/2001) Supersedes BS EN 61337-1-1 (05/2014)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| I.S. EN 171000:2001 | Identical |
| EN 171000:2001 | Identical |
| DIN EN 171000:2002-02 | Identical |
| NEN EN 171000 : 2001 | Identical |
| SN EN 171000 : 2001 | Identical |
| NF EN 171000 : 2005 | Identical |
| CECC 00114-3 : 94 AMD 2 | CAPABILITY APPROVAL OF AN ELECTRONIC COMPONENT MANUFACTURING ACTIVITY |
| CECC 00109 : 1974 | CECC RULES OF PROCEDURE: RP 9: CERTIFIED TESTS RECORDS |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| CECC 00111 PT3 : 1991 AMD 4 | CENELEC ELECTRONIC COMPONENTS COMMITTEE - RULE OF PROCEDURE 11 - SPECIFICATIONS - PART 3: REGULATIONS CECC SPECIFICATIONS FOR COMPONENTS GENERAL AND PROFESSIONAL (CIVIL AND MILITARY) USAGE (EXCLUDING DETAIL SPECIFICATIONS) |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| HD 323.2.13 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST M: LOW AIR PRESSURE |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| HD 323.2.14 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST N: OF TEMPERATURE |
| EN 60068-2-7:1993 | Environmental testing - Part 2: Tests - Test Ga: Acceleration, steady state |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| HD 323.2.30 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - TEST DB AND GUIDANCE: DAMP HEAT, CYCLIC (12 + 12-HOUR CYCLE) |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| HD 323.2.3 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
| CECC 00114-2 : 1994 | RULE OF PROCEDURE 14 - QUALITY ASSESSMENT PROCEDURES - PART 2: QUALIFICATION APPROVAL OF ELECTRONIC COMPONENTS |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-2a:1976 | Supplement A - Basic environmental testing procedures - Part 2: Tests - Tests B: Dry heat |
| EN 60068-2-29:1993 | Environmental testing - Part 2: Tests - Test Eb and guidance: Bump |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| HD 323.2.58 : 200S1 | TEST TD: SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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