BS EN 60068-2-21:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Hardcopy , PDF
04-12-2021
English
30-04-2012
1 Scope
2 Normative references
3 Test Ua[1]: tensile
3.1 Object
3.2 General description
3.3 Preconditioning
3.4 Initial measurements
3.5 Test method
3.6 Final measurements
3.7 Information to be given in the relevant specification
4 Test Ua[2]: thrust
4.1 Object
4.2 General description
4.3 Preconditioning
4.4 Initial measurements
4.5 Test method
4.6 Final measurements
4.7 Information to be given in the relevant specification
5 Test Ub: bending
5.1 Object
5.2 General description
5.3 Preconditioning
5.4 Initial measurements
5.5 Test method
5.6 Final measurements
5.7 Information to be given in the relevant specification
6 Test Uc: torsion
6.1 Object
6.2 Preconditioning
6.3 Initial measurements
6.4 Test method
6.5 Final measurements
6.6 Information to be given in the relevant specification
7 Test Ud: torque
7.1 Object
7.2 General description
7.3 Preconditioning
7.4 Initial measurements
7.5 Test method
7.6 Final measurements
7.7 Information to be given in the relevant specification
8 Test Ue: robustness of terminations for SMD in the mounted
state
8.1 Object
8.2 General description
8.3 Mounting
8.4 Initial measurements
8.5 Test methods
8.6 Final measurements
8.7 Information to be given in the relevant specification
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
Applies to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.
Committee |
EPL/501
|
DevelopmentNote |
Supersedes BS 2011-2.1U(1984). (10/1999) Supersedes 79/27146 DC. (09/2005) Supersedes 04/30112710 DC. (10/2006)
|
DocumentType |
Standard
|
Pages |
32
|
PublisherName |
British Standards Institution
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations. Table 1 provides details of the applicable tests. Table 1 – Application Test Type Component Mounted/not mounted Ua1 Tensile Leaded devices Not mounted Ua2 Thrust Leaded devices Not mounted Ub Bending Leaded devices Not mounted Uc Torsion Leaded devices Not mounted Ud Torque Threaded stud or screw termination Not mounted Ue1 Bending Surface mounted devices Mounted Ue2 Pull/push Surface mounted devices Mounted Ue3 Shear Surface mounted devices Mounted
Standards | Relationship |
DIN EN 60068-2-21:2007-01 | Identical |
UNE-EN 60068-2-21:2007 | Identical |
I.S. EN 60068-2-21:2006 | Identical |
IEC 60068-2-21:2006/COR1:2012 | Identical |
EN 60068-2-21:2006 | Identical |
SN EN 60068-2-21 : 2006 | Identical |
NF EN 60068-2-21 : 2013 | Identical |
IEC 60068-2-21:2006 | Identical |
DEFSTAN 22-48/2(2001) : 2001 | SPECIFICATION FOR POSITIVE TEMPERATURE COEFFICIENT THERMISTORS FOR THERMAL PROTECTION OF ELECTRIC MOTORS |
DEFSTAN 22-48/3(2010) : 2010 | SPECIFICATION FOR POSITIVE TEMPERATURE COEFFICIENT THERMISTORS FOR THERMAL PROTECTION OF ELECTRIC MOTORS |
ISO 272:1982 | Fasteners — Hexagon products — Widths across flats |
HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 60068-2-61:1991 | Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence |
IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
EN 60068-2-61:1993 | Environmental testing - Part 2: Test methods - Test Z/ABDM: Climatic sequence |
EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 29453 : 1993 | SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS |
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