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BS EN 60068-2-21:2006

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices

Available format(s)

Hardcopy , PDF

Superseded date

04-12-2021

Language(s)

English

Published date

30-04-2012

€231.38
Excluding VAT

1 Scope
2 Normative references
3 Test Ua[1]: tensile
  3.1 Object
  3.2 General description
  3.3 Preconditioning
  3.4 Initial measurements
  3.5 Test method
  3.6 Final measurements
  3.7 Information to be given in the relevant specification
4 Test Ua[2]: thrust
  4.1 Object
  4.2 General description
  4.3 Preconditioning
  4.4 Initial measurements
  4.5 Test method
  4.6 Final measurements
  4.7 Information to be given in the relevant specification
5 Test Ub: bending
  5.1 Object
  5.2 General description
  5.3 Preconditioning
  5.4 Initial measurements
  5.5 Test method
  5.6 Final measurements
  5.7 Information to be given in the relevant specification
6 Test Uc: torsion
  6.1 Object
  6.2 Preconditioning
  6.3 Initial measurements
  6.4 Test method
  6.5 Final measurements
  6.6 Information to be given in the relevant specification
7 Test Ud: torque
  7.1 Object
  7.2 General description
  7.3 Preconditioning
  7.4 Initial measurements
  7.5 Test method
  7.6 Final measurements
  7.7 Information to be given in the relevant specification
8 Test Ue: robustness of terminations for SMD in the mounted
  state
  8.1 Object
  8.2 General description
  8.3 Mounting
  8.4 Initial measurements
  8.5 Test methods
  8.6 Final measurements
  8.7 Information to be given in the relevant specification
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications
Bibliography

Applies to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.

Committee
EPL/501
DevelopmentNote
Supersedes BS 2011-2.1U(1984). (10/1999) Supersedes 79/27146 DC. (09/2005) Supersedes 04/30112710 DC. (10/2006)
DocumentType
Standard
Pages
32
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations. Table 1 provides details of the applicable tests. Table 1 – Application Test Type Component Mounted/not mounted Ua1 Tensile Leaded devices Not mounted Ua2 Thrust Leaded devices Not mounted Ub Bending Leaded devices Not mounted Uc Torsion Leaded devices Not mounted Ud Torque Threaded stud or screw termination Not mounted Ue1 Bending Surface mounted devices Mounted Ue2 Pull/push Surface mounted devices Mounted Ue3 Shear Surface mounted devices Mounted

DEFSTAN 22-48/2(2001) : 2001 SPECIFICATION FOR POSITIVE TEMPERATURE COEFFICIENT THERMISTORS FOR THERMAL PROTECTION OF ELECTRIC MOTORS
DEFSTAN 22-48/3(2010) : 2010 SPECIFICATION FOR POSITIVE TEMPERATURE COEFFICIENT THERMISTORS FOR THERMAL PROTECTION OF ELECTRIC MOTORS

ISO 272:1982 Fasteners — Hexagon products — Widths across flats
HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 60068-2-61:1991 Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 60068-2-61:1993 Environmental testing - Part 2: Test methods - Test Z/ABDM: Climatic sequence
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 29453 : 1993 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS

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