BS EN 60191-6-1:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals
Hardcopy , PDF
English
29-03-2002
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1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.
| Committee |
EPL/47
|
| DevelopmentNote |
Also numbered as IEC 60191-6-1. (05/2002)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
| Standards | Relationship |
| NF EN 60191-6-1 : 2002 | Identical |
| EN 60191-6-1:2001 | Identical |
| I.S. EN 60191-6-1:2002 | Identical |
| UNE-EN 60191-6-1:2002 | Identical |
| DIN EN 60191-6-1:2002-08 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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